BGA Reballing Stencil Precise Positioning Stainless Steel Tin Planting Template for IOS 12 Series A1

Feature: 1. APPLICABLE MODEL: This reballing stencil is suitable for A14 CPU, for IOS12, for IOS12MINI, for IOS12 Pro, for IOS12 Pro Maximum models. 2. UNIQUE DESIGN: The reball stencil is designed with multiple IC slots, which effectively prevent small IC from sticking tin and breaking corners. 3. PRECISE MADE: The reballing template is precisely made, which could accurately locate the accessory, provides high efficiency. 4. STAINLESS STEEL MATERIAL: The tin planting template is made from premium stainless steel, with high strength and strong toughness. 5. HIGH TEMPERATURE RESISTANT: The CPU reballing stencil will not easily changed or deformed under high temperature, more reliable to use. Specification: Item Type: BGA Reballing Stencil Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For A14 Applicable Models: For IOS12, for IOS12MINI, for IOS12 Pro, for IOS12 Pro Maximum Package List: 1 x BGA Reballing Stencil