Specification:
Material: tinplussolder paste
Color: As picture shown
Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
Type: XG-Z40
Microns: 25-45um
Description:
MECHANIC XG-Z40 High synthetic BGA Solder Flux Paste Soldering Tin Cream 10ml solder paste tin. Applicable to PCB, BGA, SMD, PGA repair repair. Mechanic solder tin paste xg-z40 Solder Paste Flux 25-45um Syringe to Mobile Phone Repair Services Indust
MECHANIC XG-Z40 High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream
PCB BGA Soldering Paste Flux Solder BAG Ball Flux Paste
Features:
The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.
It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.
Soldering paste for cell phone PCB and SMD etc.
Help to repair the circuit boards and protect the electronic components
A necessary material for repairing the mobile phone mainboard
Flux Solder Paste - no clean soldering
Package includes:
XG-Z40 Lead Solder Paste with Syringe *1
Note:
1.Due to the different monitor and light effect, the actual color of the item might be slightly different from the color which is showed on the pictures.
2.Please forgive 1 cm/0.39"-3 cm/1.18" measuring deviation due to manual measurement.
The merchant warrants that their products comply with all applicable laws, and are offered only if they comply with Joom's policies and EU Product Safety and Compliance laws.
